PCB Thermal Management is crucial for ensuring reliability and performance in electronic systems. Overheating of PCBs can lead to the degradation and failure of electronic components. Hence, it is important to effectively perform temperature control for PCBs.

PCB layering is the process of designing and manufacturing printed circuit boards that contain multiple layers of conductive material layered between insulating layers.

Design for Manufacturing also known as DFM is a set of guidelines aimed to at optimizing product designs for streamlined manufacturing. It involves a detailed analysis of factors like material selection, manufacturing techniques, and assembly processes at the design stage.

Jitter is the variation in the timing of digital signals which is often caused due to factors such as noise, interference, or timing errors within the electronic system. Jitter happens when electronic signals arrive at unexpected times, causing problems like signal disruptions and making the electronic system work less effectively.

Plated through holes (PTH) in PCBs are like tiny tunnels or pathways that run from one side of the circuit board to the other. They're made with a conductive material like copper which lets electrical signals pass through different layers of the PCB.

Ceramic Substrate PCBs are a specialized category of circuit boards crafted from advanced ceramic materials, such as aluminum oxide (Al2O3) or aluminum nitride (AlN). The ceramic substrates offer many remarkable benefits when compared with the traditional substrates used for PCB manufacturing.

In the world of electronics, a PCB surface finish is like a protective and functional skin for the copper components on the board. It's a special coating applied to the exposed copper traces, ensuring they don't corrode over time and maintaining a smooth surface.

When moisture infiltrates electronic assemblies, it can react with metal surfaces, forming oxides and other compounds that can hinder the conductivity of traces and solder joints. This corrosion not only degrades electrical connections but can also cause intermittent faults or complete failure of the electronic system.